An alternative polymeric protection mask for bulk KOH etching of silicon
The utilization of a newly developed photosensitive polymeric coating, ProTEK PSB plays a significant role in realizing simple process steps in the fabrication of MEMS devices using bulk micromachining technology. The photosensitive coating serves as an alternative to the conventional silicon n...
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/24999/1/an_alternative_polymeric.pdf http://irep.iium.edu.my/24999/ http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6235295 |
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| Institution: | Universiti Islam Antarabangsa Malaysia |
| Language: | English |
| Summary: | The utilization of a newly developed photosensitive
polymeric coating, ProTEK PSB plays a significant role in
realizing simple process steps in the fabrication of MEMS
devices using bulk micromachining technology. The
photosensitive coating serves as an alternative to the
conventional silicon nitride mask of bulk KOH etching in
devising MEMS devices, particularly suspended
microcantilever structure. Although the coating is an excellent
outer protective layer from any pinhole issues, the lateral
etching in KOH solution is prominent, which results in an
undercut issue. Therefore, the combination of ProTEK PSB
and thermal oxide layer was studied for its possibility in
obtaining minimum undercut-etch depth ratio of the polymeric
coating in KOH (45%wt, 80oC). The combination of ProTEK
PSB patterned on thermal oxide results in an effective etching
condition attributed by minimum undercut ratio with respect
to the etch depth. |
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