Modelling and optimization of copper electroplating adhesion strength

• Main Authors: -, Suryanto, Haider, Farag, Ani, Mohd Hanafi, Mahmood, Mahmood Hameed
• Format: Article
• Language: English; English; English
• Published: Institute of Physics 2017
• Subjects: TA401 Materials of engineering and construction
• Online Access: http://irep.iium.edu.my/55778/1/Modelling%20and%20Optimization.pdf; http://irep.iium.edu.my/55778/7/55778_Modelling%20and%20Optimization%20of%20Copper_SCOPUS.pdf; http://irep.iium.edu.my/55778/13/55778%20Modelling%20and%20optimization%20of%20copper%20electroplating%20WOS.pdf; http://irep.iium.edu.my/55778/; http://iopscience.iop.org/article/10.1088/1757-899X/204/1/012017/pdf
• Institution: Universiti Islam Antarabangsa Malaysia

In this paper, Response surface methodology (RSM) was utilized to design the experiments at the settings of CuSO4 and H2SO4 concentrations and current densities. It also used for modelling and optimize the parameters on the adhesion strength of austenitic stainless steel substrate. The adhesion stre...