Fabrication of micro magnetometer using flip-chip bonding technique

• Main Authors: Tengku Azmi, Tengku Muhammad Afif, Sulaiman, Nadzril
• Format: Conference or Workshop Item
• Language: English
• Published: 2017
• Subjects: TK Electrical engineering. Electronics Nuclear engineering; TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices
• Online Access: http://irep.iium.edu.my/56707/12/56707_fabrication%20%20of%20Micro%20Magnet%20Magnetometer_complete.pdf; http://irep.iium.edu.my/56707/; http://www.worldresearchlibrary.org/proceeding.php?pid=702
• Institution: Universiti Islam Antarabangsa Malaysia

Magnetic field has been widely explored for its benefit towards todays development. In the early stage, the main concern was to develop a device that can detect magnetic field. Such device is called magnetometer. The advancement of technology has push the boundary even further, making a portable an...