The implementation of low cost mineral silica in underfill system / Farrah Noor Ahmad and Ghazirah Mustapha @ Mustafa

• Main Authors: Ahmad, Farrah Noor, Mustapha @ Mustafa, Ghazirah
• Format: Research Reports
• Language: English
• Published: 2010
• Subjects: Mechanics applied to machinery. Dynamics
• Online Access: https://ir.uitm.edu.my/id/eprint/102005/1/102005.PDF; https://ir.uitm.edu.my/id/eprint/102005/
• Institution: Universiti Teknologi Mara

In electronics packaging, underfill is needed to improve package reliability in flip- chip devices. The introduction of an underfill which is made up of an epoxy polymer with significant amounts of filler have raises some reliability issues, such as mechanical and thermal reliability. In this study,...