Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder

• Main Authors: Goh, Y., Haseeb, A.S. Md. Abdul, Sabri, Mohd Faizul Mohd
• Format: Article
• Published: Elsevier 2013
• Subjects: TA Engineering (General). Civil engineering (General); TJ Mechanical engineering and machinery
• Online Access: http://eprints.um.edu.my/11757/; http://www.sciencedirect.com/science/article/pii/S0013468612019950; http://dx.doi.org/10.1016/j.electacta.2012.12.036
• Institution: Universiti Malaya

The effects of an antioxidant, hydroquinone (HQ) and a grain refining additive, gelatin, on the electroplating characteristics of Sn–Bi alloys were investigated. Methane sulfonic acid (MSA) based plating baths with varying contents of additives were prepared and the electrochemical behavior of each...