Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints

• Main Authors: Othman, R., Binh, D.N., Ismail, A.B., Long, B.D., Ariga, T.
• Format: Article
• Published: Elsevier 2012
• Subjects: TA Engineering (General). Civil engineering (General)
• Online Access: http://eprints.um.edu.my/11833/; http://www.sciencedirect.com/science/article/pii/S0966979511003256; http://doi.org/10.1016/j.intermet.2011.10.011
• Institution: Universiti Malaya

The formation and growth of intermetallic compounds (IMCs) between lead-free solder alloys and Cu substrate were investigated. Cu6Sn5 IMC was formed in the Sn–3Ag–0.5Cu solder joint, whilst Cu5Zn8 IMC was formed in the Sn–9Zn and Sn–8Zn–3Bi solder joints after soldering. After exposure to a current...