Stitch bond strength study in insulated Cu wire bonding
The market demands for higher pin counts and more chips functionality pose challenges in conventional wire bonding. However, insulated Cu wire technology enables fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. This paper presents the...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Published: |
Maney Publishing
2014
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/15471/ |
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| Institution: | Universiti Malaya |