Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects

• Main Authors: Chia, P.Y., Haseeb, A.S. Md. Abdul, Mannan, S.H.
• Format: Article
• Language: English
• Published: MDPI 2016
• Subjects: QC Physics; TJ Mechanical engineering and machinery
• Online Access: http://eprints.um.edu.my/17437/1/HaseebASMA_%282016%29.pdf; http://eprints.um.edu.my/17437/; http://dx.doi.org/10.3390/ma9060430
• Institution: Universiti Malaya

Miniaturization of electronic devices has led to the development of 3D IC packages which require ultra-small-scale interconnections. Such small interconnects can be completely converted into Cu-Sn based intermetallic compounds (IMCs) after reflow. In an effort to improve IMC based interconnects, an...