In-situ study of electrochemical migration of tin in the presence of bromide ion

The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the ECM process. This work systematically investigates th...

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Bibliographic Details
Main Authors: Lee, Ee Lynn, Haseeb, A. S. M. A., Basirun, Wan Jeffrey, Wong, Yew Hoong, Mohd Sabri, Mohd Faizul, Low, Boon Yew
Format: Article
Published: Nature Research 2021
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Online Access:http://eprints.um.edu.my/28293/
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Institution: Universiti Malaya