A PCB soldering joint defect recognition system using convolutional neural network

• Main Authors: Tai, K.W., Chuah, Joon Huang, Leong, H., Kamarudin, N.H.
• Format: Conference or Workshop Item
• Published: 2021
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.um.edu.my/36126/; https://www.scopus.com/inward/record.uri?eid=2-s2.0-85126454129&doi=10.1109%2fi-PACT52855.2021.9696857&partnerID=40&md5=137ac404bea13941600b141de7e01b39
• Institution: Universiti Malaya

In the recent years, the implementation of artificial intelligence in various industry has increased significantly. This is due to the Industrial Revolution 4.0 (IR4.0) where the industry needs to move towards a smart industry. This paper discusses the development of a model to detect multiple types...