Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu
Purpose The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint according to the formulation of solder paste because of different types of fluxes. Design/methodology/approach Solder pastes were prepared by mix...
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| Main Authors: | , , , , |
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| Format: | Article |
| Published: |
Emerald Group Publishing Ltd
2020
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/36894/ |
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| Institution: | Universiti Malaya |