Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint

Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint

Eutectic Sn-Bi alloy is acquiring significant observation in the electronic packaging industry because of its advantageous properties such as ductility, low melting temperature, and mechanical strength. Miniaturization of electronic devices requires solder paste having a low melting temperature for...

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Bibliographic Details
Main Authors: Bashir, Muhammad Nasir, Haseeb, A. S. M. A., Naher, Sumsun, Ali, Muhammad Mahmood, Bashir, Mohamed Bashir Ali, Zaidi, Asad A. A., Jamshaid, Muhammad, Javed, Iqra
Format: Article
Published: Springer 2023
Subjects:
QC Physics
TJ Mechanical engineering and machinery
Online Access:http://eprints.um.edu.my/38677/
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Institution: Universiti Malaya

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http://eprints.um.edu.my/38677/

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