Role of crystallographic orientation of β-sn grain on electromigration failures in lead-free solder joint: An overview

Role of crystallographic orientation of β-sn grain on electromigration failures in lead-free solder joint: An overview

Due to the miniaturization of electronic devices, electromigration became one of the serious reliability issues in lead-free solder joints. The orientation of the beta-Sn grain plays an important role in electromigration failures. Several studies have been carried out to investigate the effect of Sn...

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Main Authors: Bashir, Muhammad Nasir, Butt, Sajid Ullah, Mansoor, Muhammad Adil, Khan, Niaz Bahadur, Bashir, Shahid, Wong, Yew Hoong, Alamro, Turki, Eldin, Sayed Mohamed, Jameel, Mohammed
Format: Article
Published: MDPI 2022
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.um.edu.my/46193/
https://doi.org/10.3390/coatings12111752
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Institution: Universiti Malaya

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http://eprints.um.edu.my/46193/
https://doi.org/10.3390/coatings12111752

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