Thickness effect of micro speaker copper coil fabrication process

• Main Authors: Ayat, F.L., Moghavvemi, M., Attaran, A.
• Format: Article
• Published: IFSA 2011
• Subjects: TA Engineering (General). Civil engineering (General)
• Online Access: http://eprints.um.edu.my/9743/
• Institution: Universiti Malaya

This paper present the advantage of using electroplating for making the thick layer of copper over the sputtering. The purpose of this paper is to fabricate the copper coil for microspeaker. The design and simulation of this copper coil shows that the 15 um thickness is needed. In order to fabricate...