Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package / Saif Wakeel

The complexity of cleaning caused by miniaturization of electronic packages and the drive towards cost reduction have recently led to the development of no-clean fluxes (NCF). In this study, characterization and effect of two commercial NCF namely NC-1 and NC-2 on the fine pitch flip-chip package we...

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Bibliographic Details
Main Author: Saif , Wakeel
Format: Thesis
Published: 2021
Subjects:
Online Access:http://studentsrepo.um.edu.my/13581/1/Saif_Wakeel.jpg
http://studentsrepo.um.edu.my/13581/8/saif.pdf
http://studentsrepo.um.edu.my/13581/
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Institution: Universiti Malaya
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