Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package / Saif Wakeel

• المؤلف الرئيسي: Saif , Wakeel
• التنسيق: أطروحة
• منشور في: 2021
• الموضوعات: TA Engineering (General). Civil engineering (General)
• الوصول للمادة أونلاين: http://studentsrepo.um.edu.my/13581/1/Saif_Wakeel.jpg; http://studentsrepo.um.edu.my/13581/8/saif.pdf; http://studentsrepo.um.edu.my/13581/

The complexity of cleaning caused by miniaturization of electronic packages and the drive towards cost reduction have recently led to the development of no-clean fluxes (NCF). In this study, characterization and effect of two commercial NCF namely NC-1 and NC-2 on the fine pitch flip-chip package we...