Ultrasonic assisted reflow soldering of lead free solder joint / Tan Ai Ting

• المؤلف الرئيسي: Tan, Ai Ting
• التنسيق: أطروحة
• منشور في: 2017
• الموضوعات: TJ Mechanical engineering and machinery
• الوصول للمادة أونلاين: http://studentsrepo.um.edu.my/7797/1/All.pdf; http://studentsrepo.um.edu.my/7797/7/Tan_Ai_Ting_%2D_Thesis.pdf; http://studentsrepo.um.edu.my/7797/

The present thesis focused on the development of ultrasonic assisted reflow soldering technique to improve the reliability of lead free solder joint in the electronic packaging application by integrating ultrasonic vibration (USV) into the reflow stage of a reflow soldering process. In the prelimina...