Effect of addition Zinc in Tin-Copper lead free solder on corrosion study in chloride solution
Sn-0.7Cu lead free solder has become an alternative material to replace Sn-Pb solder. However, it has disadvantages of high melting point and poor corrosion behavior. Through this study, corrosion rate and corrosion behavior of Sn-0.7-xZn in 3.5 wt.% sodium chloride (NaCl) solution was studied throu...
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| Format: | Undergraduate Final Project Report |
| Published: |
2019
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| Online Access: | http://discol.umk.edu.my/id/eprint/4869/ |
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| Institution: | Universiti Malaysia Kelantan |