Finite element analysis of heat sink in term of thermal and temperature distribution with different chip power input

Finite element analysis of heat sink in term of thermal and temperature distribution with different chip power input

This paper presents the simulation of heat sink by using Workbench 18.0 Software to simulate the temperature distribution at different chip power input. 3D model of heat sink is generated using Design Modeler using the same dimension with experimental setup. The study was made for a heat sink mounte...

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Bibliographic Details
Main Authors: Mohamed, Mazlan, Nazri Omar, Mohd, Shaiful Ashrul Ishak, Mohamad, Rahman, Rozyanty, Fahmi Mohd Roslan, Muhamad, Nur Hafiz Shaidan, Muhammad, Ismael Rizman, Zairi
Format: Indexed Article
Language:English
Published: Scopus 2018
Online Access:http://discol.umk.edu.my/id/eprint/7374/1/IJET-11221.pdf
http://discol.umk.edu.my/id/eprint/7374/
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Institution: Universiti Malaysia Kelantan
Language: English

Internet

http://discol.umk.edu.my/id/eprint/7374/1/IJET-11221.pdf
http://discol.umk.edu.my/id/eprint/7374/

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