Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application

Thermal pad is new technology in this world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. In electronic industry, the electronic components that exceed 70ºC will malfunction and damage due to the overheated. The design is used nano-silv...

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Main Authors:	Mazlan Mohamed, Rahim Atan, Abdullah Mohd Mustafa Al Bakri, Muhamad Iqbal Ahmad, Huzaifah Mohd Yusoff, Fathinul Ahmad Jabib Saad
Format:	Non-Indexed Article
Published:	Trans-Tech Publication 2012
Online Access:	http://discol.umk.edu.my/id/eprint/7831/ http://dx.doi.org/10.4028/www.scientific.net/AMR.626.980
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Institution:	Universiti Malaysia Kelantan

id	my.umk.eprints.7831
record_format	eprints
spelling	my.umk.eprints.78312022-05-23T10:23:00Z http://discol.umk.edu.my/id/eprint/7831/ Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application Mazlan Mohamed Rahim Atan Abdullah Mohd Mustafa Al Bakri Muhamad Iqbal Ahmad Huzaifah Mohd Yusoff Fathinul Ahmad Jabib Saad Thermal pad is new technology in this world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. In electronic industry, the electronic components that exceed 70ºC will malfunction and damage due to the overheated. The design is used nano-silver as main material in thermo pad because it has high value of thermal conductivity and enables to dissipate heat very efficiently. The simulation of thermal pad in semiconductor is using FLUENTTM software. The results from simulation is been compared to the results from experiment. The differences between those results are less than 10%. The advantages of thermal pad are enables to reduce junction temperature of PLCC 20-30%. It also had constant thickness in order to get constant and accurate results Trans-Tech Publication 2012 Non-Indexed Article NonPeerReviewed Mazlan Mohamed and Rahim Atan and Abdullah Mohd Mustafa Al Bakri and Muhamad Iqbal Ahmad and Huzaifah Mohd Yusoff and Fathinul Ahmad Jabib Saad (2012) Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application. Advanced Materials Research, 626. pp. 980-988. ISSN 1662-8985 http://dx.doi.org/10.4028/www.scientific.net/AMR.626.980 doi:10.4028/www.scientific.net/AMR.626.980 doi:10.4028/www.scientific.net/AMR.626.980
institution	Universiti Malaysia Kelantan
building	Perpustakaan Universiti Malaysia Kelantan
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaysia Kelantan
content_source	UMK Institutional Repository
url_provider	http://umkeprints.umk.edu.my/
description	Thermal pad is new technology in this world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. In electronic industry, the electronic components that exceed 70ºC will malfunction and damage due to the overheated. The design is used nano-silver as main material in thermo pad because it has high value of thermal conductivity and enables to dissipate heat very efficiently. The simulation of thermal pad in semiconductor is using FLUENTTM software. The results from simulation is been compared to the results from experiment. The differences between those results are less than 10%. The advantages of thermal pad are enables to reduce junction temperature of PLCC 20-30%. It also had constant thickness in order to get constant and accurate results
format	Non-Indexed Article
author	Mazlan Mohamed Rahim Atan Abdullah Mohd Mustafa Al Bakri Muhamad Iqbal Ahmad Huzaifah Mohd Yusoff Fathinul Ahmad Jabib Saad
spellingShingle	Mazlan Mohamed Rahim Atan Abdullah Mohd Mustafa Al Bakri Muhamad Iqbal Ahmad Huzaifah Mohd Yusoff Fathinul Ahmad Jabib Saad Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application
author_facet	Mazlan Mohamed Rahim Atan Abdullah Mohd Mustafa Al Bakri Muhamad Iqbal Ahmad Huzaifah Mohd Yusoff Fathinul Ahmad Jabib Saad
author_sort	Mazlan Mohamed
title	Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application
title_short	Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application
title_full	Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application
title_fullStr	Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application
title_full_unstemmed	Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application
title_sort	three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application
publisher	Trans-Tech Publication
publishDate	2012
url	http://discol.umk.edu.my/id/eprint/7831/ http://dx.doi.org/10.4028/www.scientific.net/AMR.626.980
_version_	1763303897019973632

Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application

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