Thermal Management of Electronic Components by Using Computational Fluid Dynamic (CFD) Software, FLUENT in several material applications (Epoxy, Composite Material & Nanosilver)

Thermal Management of Electronic Components by Using Computational Fluid Dynamic (CFD) Software, FLUENT in several material applications (Epoxy, Composite Material & Nanosilver)

This paper presents the thermal management of electrocnic components, microprocessor by using three dimensional numerical anlysis of heat and fluid flow in computer. 3D model of microprocessors in built using GAMBIT and simulated using FLUENT software. The study was made for four microprocessors arr...

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Bibliographic Details
Main Authors: Mazlan Mohamed, Abdul Rahim, Abdullah Mohd Mustafa Al Bakri, Razak Wahab, A.F. Zubair, Y.M. Najib, Ahmad Bakir Azman
Format: Non-Indexed Article
Published: Trans-Tech Publication 2013
Online Access:http://discol.umk.edu.my/id/eprint/7865/
http://www.scientific.net/AMR.795.141
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Institution: Universiti Malaysia Kelantan

Internet

http://discol.umk.edu.my/id/eprint/7865/
http://www.scientific.net/AMR.795.141

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