Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application

Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application

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Bibliographic Details
Main Authors: Mohamed, Mazlan, Atan, Rahim, Mustafa Al Bakri, Abdullah Mohd, Ahmad, Muhammad Iqbal, Yusoff, Mohd Huzaifah, Saad, Fathinul Najib Ahmad
Format: Non-Indexed Article
Language:English
Published: Trans-Tech Publication 2012
Online Access:http://discol.umk.edu.my/id/eprint/7882/1/AMR.626.980.pdf
http://discol.umk.edu.my/id/eprint/7882/
http://dx.doi.org/10.4028/www.scientific.net/AMR.626.980
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Institution: Universiti Malaysia Kelantan
Language: English

Internet

http://discol.umk.edu.my/id/eprint/7882/1/AMR.626.980.pdf
http://discol.umk.edu.my/id/eprint/7882/
http://dx.doi.org/10.4028/www.scientific.net/AMR.626.980

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