Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy

The aim of this research paper is to study the effects of cooling rates on microstructure and mechanical properties of Sn3.8Ag0.7Cu solder alloy prepared through powder metallurgy (PM) method. They were cooled by different cooling medium such as slow (furnace cooling), normal (air cooling) and fast...

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Bibliographic Details
Main Authors: Siti Rabiatull Aisha, Idris, Nadhrah, Murad, M., Ishak
Format: Article
Language:English
Published: Elsevier Ltd 2017
Subjects:
Online Access:http://umpir.ump.edu.my/id/eprint/17663/1/Jurnal%20Procedia%20Engineering_Nadhrah.pdf
http://umpir.ump.edu.my/id/eprint/17663/
https://doi.org/10.1016/j.proeng.2017.04.094
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Institution: Universiti Malaysia Pahang
Language: English