Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy
The aim of this research paper is to study the effects of cooling rates on microstructure and mechanical properties of Sn3.8Ag0.7Cu solder alloy prepared through powder metallurgy (PM) method. They were cooled by different cooling medium such as slow (furnace cooling), normal (air cooling) and fast...
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier Ltd
2017
|
| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/17663/1/Jurnal%20Procedia%20Engineering_Nadhrah.pdf http://umpir.ump.edu.my/id/eprint/17663/ https://doi.org/10.1016/j.proeng.2017.04.094 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Universiti Malaysia Pahang |
| Language: | English |