Effect of different amount of Silicon Carbide on SAC Solder-Cu Joint performance by using Microwave hybrid heating method

• Main Authors: N. M., Maliessa, S. R. A., Idris
• Format: Conference or Workshop Item
• Language: English
• Published: IOP Publishing 2019
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://umpir.ump.edu.my/id/eprint/24327/1/Effect%20of%20Different%20Amount%20of%20Silicon%20Carbide.pdf; http://umpir.ump.edu.my/id/eprint/24327/; https://doi.org/10.1088/1757-899X/469/1/012110
• Institution: Universiti Malaysia Pahang

Microwave hybrid heating (MHH) has been recognized for soldering process especially with lead-free solder alloy. This study seeks to investigates the effect of different amount of susceptor on the Sn-3.0Ag-0.5Cu-Copper (SAC305-Cu) joint performance by using MHH method. The susceptor material that wa...