Fibre laser soldering operation and its effect onto intermetallic compound at the solder joint: short review

Nowadays the application of laser technology in microelectronic packaging has been widely implemented in many developed countries. Its flexibility on setting the parameters by following individual’s requirement, localized heating, non-contact heating, fast heating and cooling rate makes it one of th...

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Bibliographic Details
Main Authors: Nabila, Tamar Jaya, Siti Rabiatull Aisha, Idris
Format: Conference or Workshop Item
Language:English
English
Published: Universiti Malaysia Pahang 2019
Subjects:
Online Access:http://umpir.ump.edu.my/id/eprint/27993/1/25.%20Fibre%20laser%20soldering%20operation%20and%20its%20effect.pdf
http://umpir.ump.edu.my/id/eprint/27993/2/25.1%20Fibre%20laser%20soldering%20operation%20and%20its%20effect.pdf
http://umpir.ump.edu.my/id/eprint/27993/
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Institution: Universiti Malaysia Pahang
Language: English
English