Effect of Different Nickel Percentage in Solder Alloy towards Intermetallic Compound Formation and Growth

Effect of Different Nickel Percentage in Solder Alloy towards Intermetallic Compound Formation and Growth

The growth of electronics product has increased rapidly and hence drive challenges among the designers as well as manufacturers to select the best electronic packaging materials for their products. Among those materials, lead free solders has become the best replacement for lead-containing solders e...

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Bibliographic Details
Main Authors: Muhammad Asyraf, Abdullah, Siti Rabiatull Aisha, Idris
Format: Conference or Workshop Item
Language:English
Published: IOP Publishing 2021
Subjects:
TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
TN Mining engineering. Metallurgy
Online Access:http://umpir.ump.edu.my/id/eprint/33589/7/Effect%20of%20Different%20Nickel%20Percentage%20in%20Solder.pdf
http://umpir.ump.edu.my/id/eprint/33589/
https://doi.org/10.1088/1757-899X/1092/1/012012
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Institution: Universiti Malaysia Pahang
Language: English

Internet

http://umpir.ump.edu.my/id/eprint/33589/7/Effect%20of%20Different%20Nickel%20Percentage%20in%20Solder.pdf
http://umpir.ump.edu.my/id/eprint/33589/
https://doi.org/10.1088/1757-899X/1092/1/012012

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