Study of underfill flow in microchip packaging using ansys

Study of underfill flow in microchip packaging using ansys

The project was related to microchip application where adhesive fluid is used to stick the microchip onto the electrical flat base. In this project, 5mm of width and length of microchip with 3 different types of solder ball diameter sizes are used in this project. The objective of the project is to...

Full description

Saved in:
Bibliographic Details
Main Authors: Hussin, N.F.R., Rosli, N.
Format: Article
Language:English
Published: Penerbit UMP 2022
Subjects:
T Technology (General)
TK Electrical engineering. Electronics Nuclear engineering
TS Manufactures
Online Access:http://umpir.ump.edu.my/id/eprint/35701/1/Study%20of%20Underfill%20Flow%20in%20Microchip%20PackagingUsing%20Ansys.pdf
http://umpir.ump.edu.my/id/eprint/35701/
https://doi.org/10.15282/jmmst.v6i2.8571
https://doi.org/10.15282/jmmst.v6i2.8571
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Universiti Malaysia Pahang
Language: English

Internet

http://umpir.ump.edu.my/id/eprint/35701/1/Study%20of%20Underfill%20Flow%20in%20Microchip%20PackagingUsing%20Ansys.pdf
http://umpir.ump.edu.my/id/eprint/35701/
https://doi.org/10.15282/jmmst.v6i2.8571
https://doi.org/10.15282/jmmst.v6i2.8571

Similar Items