Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering

Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering

The awareness of lead-free solders can be attributed to their environmental and human-health related benefits. Due to this consciousness, research toward lead-free solder alloy became a concern. Tin-copper (SnCu) solder alloy is one of the candidates that can meet the characteristic of tin–lead (SnP...

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Bibliographic Details
Main Authors: Muhammad Asyraf, Abdullah, Siti Rabiatull Aisha, Idris
Format: Conference or Workshop Item
Language:English
Published: Springer Nature 2023
Subjects:
TJ Mechanical engineering and machinery
TS Manufactures
Online Access:http://umpir.ump.edu.my/id/eprint/37467/1/Effect%20of%20Sn-xCu%20Solder%20Alloy%20onto%20Intermetallic%20Formation%20After%20Laser%20Soldering1.pdf
http://umpir.ump.edu.my/id/eprint/37467/
https://doi.org/10.1007/978-981-19-1457-7_67
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Institution: Universiti Malaysia Pahang
Language: English

Internet

http://umpir.ump.edu.my/id/eprint/37467/1/Effect%20of%20Sn-xCu%20Solder%20Alloy%20onto%20Intermetallic%20Formation%20After%20Laser%20Soldering1.pdf
http://umpir.ump.edu.my/id/eprint/37467/
https://doi.org/10.1007/978-981-19-1457-7_67

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