Methods of measurement of LTCC metallization thickness
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Institute of Electrical and Electronics Engineers (IEEE)
2012
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| Online Access: | http://dspace.unimap.edu.my/xmlui/handle/123456789/20231 |
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my.unimap-202312012-07-09T09:21:43Z Methods of measurement of LTCC metallization thickness Khiang, Lee Soo Norhawati, Ahmad Muammar, Mohamad Isa Rosidah, Alias norhawati@unimap.edu.my muammar@unimap.edu.my Conductive pastes Conductor pastes Cost effectives Electrical resistances LTCC (low temperature co fired ceramic) LTCC substrates Metallization Link to publisher's homepage at http://ieeexplore.ieee.org/ Metallization provides electrical routing and serves as thermal via in LTCC (Low Temperature Cofired Ceramic) technology. High electrical and thermal conductivity is desirable. It is often achieved with the use of low electrical resistance materials, such as gold, silver and copper. The conductive paste made of these materials is expensive. Hence, the fabrication of LTCC has to be performance-wise and cost effective. The width, length and thickness of metallization are associated with the amount of conductor paste used. The thickness of metallization governs the functionality and performance of some components, such as resistor. In this paper, the physical attributes of LTCC substrate and its metallization was studied. Due to the constraint brought by the physical attributes of LTCC samples, various methods had been carried out. This paper also summarized the pros and cons of each method. The methods are limited to the equipment available. 2012-07-09T09:21:42Z 2012-07-09T09:21:42Z 2008-12-01 Working Paper p. 1-7 978-142442315-6 http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=4786684 http://hdl.handle.net/123456789/20231 en Proceedings of the International Conference on Electronic Design (ICED) 2008 Institute of Electrical and Electronics Engineers (IEEE) |
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Malaysia |
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Universiti Malaysia Perlis |
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| language |
English |
| topic |
Conductive pastes Conductor pastes Cost effectives Electrical resistances LTCC (low temperature co fired ceramic) LTCC substrates Metallization |
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Conductive pastes Conductor pastes Cost effectives Electrical resistances LTCC (low temperature co fired ceramic) LTCC substrates Metallization Khiang, Lee Soo Norhawati, Ahmad Muammar, Mohamad Isa Rosidah, Alias Methods of measurement of LTCC metallization thickness |
| description |
Link to publisher's homepage at http://ieeexplore.ieee.org/ |
| author2 |
norhawati@unimap.edu.my |
| author_facet |
norhawati@unimap.edu.my Khiang, Lee Soo Norhawati, Ahmad Muammar, Mohamad Isa Rosidah, Alias |
| format |
Working Paper |
| author |
Khiang, Lee Soo Norhawati, Ahmad Muammar, Mohamad Isa Rosidah, Alias |
| author_sort |
Khiang, Lee Soo |
| title |
Methods of measurement of LTCC metallization thickness |
| title_short |
Methods of measurement of LTCC metallization thickness |
| title_full |
Methods of measurement of LTCC metallization thickness |
| title_fullStr |
Methods of measurement of LTCC metallization thickness |
| title_full_unstemmed |
Methods of measurement of LTCC metallization thickness |
| title_sort |
methods of measurement of ltcc metallization thickness |
| publisher |
Institute of Electrical and Electronics Engineers (IEEE) |
| publishDate |
2012 |
| url |
http://dspace.unimap.edu.my/xmlui/handle/123456789/20231 |
| _version_ |
1643793001859776512 |