Robust setting of Ti-6Al-4V machining using WEDM (High Energy with EF Circuit Off)

• Main Author: Muhammad Noor Aliyas
• Other Authors: Mohd Zahiruddin Md Zain (Advisor)
• Format: Learning Object
• Language: English
• Published: Universiti Malaysia Perlis 2008
• Subjects: Material Removal Rate; Surface roughness; Titanium alloys; Wire-Electrical Discharge Machine (WEDM); Electric metal-cutting; Cutting machine
• Online Access: http://dspace.unimap.edu.my/xmlui/handle/123456789/2394
• Institution: Universiti Malaysia Perlis

The purpose of this project are to optimize process variables of WEDM to obtain maximum MRR and minimum surface roughness in rough cutting. This project started with collecting the information from literature review regarding titanium alloy (Ti-6A1-4V), Wire electrical discharge machining (WEDM) and design of experiment (DOE) Classical method. The material used in this project is titanium alloy (Ti-6A1-4V). Standard Roughing Intensity power IP range (1206~1212) and others factor (pulse on time, pulse off time and servo speed) have been study. The material was cut on straight line only and 20 observation experiments have been done. Design of Experiment (DOE) Classical method was utilized to find the best combination of the parameters setting to achieve the maximum Material Removal Rate (MRR) and minimum surface roughness by studied the interaction between factors that can affect the response. With the result of analysis using DOE the confirmation process on the material have been done. There are two types of parameter set for both MRR and Ra for confirmation run which is robust and optimization setting. After the confirmation process done we are able to see the percentage of error on the predicted value using DOE and the confirmation actual value. The results on the material removal rate and surface finish have been discussed. However, the estimate error value for the MRR and Ra is not relying 10% because of some factors that affect the data taken during the observation and confirmation experiment.