The effects of the electroless copper coating to the thermal expansion behaviors of silicon carbide particles reinforced copper matrix composites for the electronic packaging applications

• Main Author: Azmi, Kamardin
• Format: Thesis
• Language: English
• Published: Universiti Malaysia Perlis (UniMAP) 2014
• Subjects: Composite; Coefficient of thermal expansion (CTE); Silicon carbide reinforced copper matrix composites; Materials engineering; Composite materials; Copper > Metallurgy
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/31222
• Institution: Universiti Malaysia Perlis

The demands for advanced thermal management materials with high thermal conductivity and low coefficient of thermal expansion (CTE) are expected to increase due to the technological progress in the thermal management hardware. Silicon carbide reinforced copper matrix (Cu-SiCp) composites are high...