Wire bond shear test simulation on hemispherical surface bond pad

Wire bond shear test simulation on hemispherical surface bond pad

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Bibliographic Details
Main Authors: Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Wan Mokhzani, Wan Norhaimi, Johari, Adnan, Assc. Prof. Dr., Palianysamy, Moganraj
Other Authors: W.M.W. Norhaimi, J. Adnan, M. Palianysamy
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
ANSYS
Hemisphere surface bond pad
Shear test
Wire bond
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/32646
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Institution: Universiti Malaysia Perlis
Language: English
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Summary:Link to publisher's homepage at http://www.ttp.net/

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