Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
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Trans Tech Publications
2014
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my.unimap-336052014-04-11T07:21:45Z Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication Muhammad Hafiz, Zan Hazizi Mohd Arif Anuar, Mohd Salleh Zainal Arifin, Ahmad, Prof. hafizhazizi@unimap.edu.my arifanuar@unimap.edu.my Composite Lead-free solder Powder metallurgy Silicon nitride Sn-0.7Cu Link to publisher's homepage at http://www.ttp.net/ The aim of this study was to optimize the mixing process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si₃N₄ were carefully weighted, mixed and blended in a mechanical alloying machine. The speed of rotation for the jar was kept constant while the time of mixing was varied. Si₃N₄ were added to the Sn-0.7Cu solder as reinforcement. Upon completion of mixing process, the mixed powders were later compacted into a thin disc. The compacted samples were then sintered in a horizontal tube furnace. Microstructural examinations by using SEM were conducted in order to analyze the distribution of Cu and Si₃N₄ particles. With the assistance of ImageJ software, average particle distributions were calculated. Results showed that the best particle distributions were achieved when the mixed powder were blended for 6 hours. 2014-04-11T07:20:04Z 2014-04-11T07:20:04Z 2014 Article Key Engineering Materials, vol.594-595, 2014, pages 765-769 1662-9795 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33605 http://www.scientific.net/KEM.594-595.765 10.4028/www.scientific.net/KEM.594-595.765 en Trans Tech Publications |
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Composite Lead-free solder Powder metallurgy Silicon nitride Sn-0.7Cu |
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Composite Lead-free solder Powder metallurgy Silicon nitride Sn-0.7Cu Muhammad Hafiz, Zan Hazizi Mohd Arif Anuar, Mohd Salleh Zainal Arifin, Ahmad, Prof. Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication |
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Link to publisher's homepage at http://www.ttp.net/ |
| author2 |
hafizhazizi@unimap.edu.my |
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hafizhazizi@unimap.edu.my Muhammad Hafiz, Zan Hazizi Mohd Arif Anuar, Mohd Salleh Zainal Arifin, Ahmad, Prof. |
| format |
Article |
| author |
Muhammad Hafiz, Zan Hazizi Mohd Arif Anuar, Mohd Salleh Zainal Arifin, Ahmad, Prof. |
| author_sort |
Muhammad Hafiz, Zan Hazizi |
| title |
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication |
| title_short |
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication |
| title_full |
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication |
| title_fullStr |
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication |
| title_full_unstemmed |
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication |
| title_sort |
mixing optimization of sn-cu-si₃n₄ via powder metallurgy route for composite solder fabrication |
| publisher |
Trans Tech Publications |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33605 |
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1643797226403659776 |