Heat sink fin number variation analysis on single chip high power LED
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2014
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my.unimap-336642014-04-13T07:48:55Z Heat sink fin number variation analysis on single chip high power LED Zaliman, Sauli, Dr. Vairavan, Rajendaran Retnasamy, Vithyacharan zaliman@unimap.edu.my Ansys Heat sink fin number High power LED Junction temperature Von mises stress Link to publisher's homepage at http://www.ttp.net/ Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating junction temperature of LED. This paper demonstrates a simulation work done to evaluate the influence heat sink fin number on the junction temperature and stress of single chip LED package using Ansys version 11. The heat sink with fin number of 4 fins, 6 fins and 8 fins were used and compared. Results showed that increase in heat sink fin number significantly reduces the junction temperature of the LED package. 2014-04-13T07:48:55Z 2014-04-13T07:48:55Z 2014-01 Article Applied Mechanics and Materials, vol.487, 2014, pages 149-152 1662-7482 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33664 http://www.scientific.net/AMM.487.149 10.4028/www.scientific.net/AMM.487.149 en Trans Tech Publications |
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Universiti Malaysia Perlis |
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UniMAP Library |
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Asia |
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Malaysia |
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Universiti Malaysia Perlis |
| content_source |
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| url_provider |
http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
Ansys Heat sink fin number High power LED Junction temperature Von mises stress |
| spellingShingle |
Ansys Heat sink fin number High power LED Junction temperature Von mises stress Zaliman, Sauli, Dr. Vairavan, Rajendaran Retnasamy, Vithyacharan Heat sink fin number variation analysis on single chip high power LED |
| description |
Link to publisher's homepage at http://www.ttp.net/ |
| author2 |
zaliman@unimap.edu.my |
| author_facet |
zaliman@unimap.edu.my Zaliman, Sauli, Dr. Vairavan, Rajendaran Retnasamy, Vithyacharan |
| format |
Article |
| author |
Zaliman, Sauli, Dr. Vairavan, Rajendaran Retnasamy, Vithyacharan |
| author_sort |
Zaliman, Sauli, Dr. |
| title |
Heat sink fin number variation analysis on single chip high power LED |
| title_short |
Heat sink fin number variation analysis on single chip high power LED |
| title_full |
Heat sink fin number variation analysis on single chip high power LED |
| title_fullStr |
Heat sink fin number variation analysis on single chip high power LED |
| title_full_unstemmed |
Heat sink fin number variation analysis on single chip high power LED |
| title_sort |
heat sink fin number variation analysis on single chip high power led |
| publisher |
Trans Tech Publications |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33664 |
| _version_ |
1643797245753032704 |