Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP

• Main Author: Tan Hui Khin
• Other Authors: Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor)
• Format: Learning Object
• Language: English
• Published: Universiti Malaysia Perlis 2008
• Subjects: Integrated circuit; Materials (Compound properties); Molding (Chemical technology); Molding; Molding > Technological innovations; Quad Flat Package
• Online Access: http://dspace.unimap.edu.my/xmlui/handle/123456789/3373
• Institution: Universiti Malaysia Perlis

In integrated circuit (IC) Packaging, there are several processes involved. The main processes for leaded package are wafer mount, wafer saw, die attach, wire bonding, molding, plating, singulation, trim and form. Molding (encapsulation process) is one of the key process which is done in order to p...