Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
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Emerald Group Publishing Limited
2014
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my.unimap-339472014-04-23T05:06:44Z Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization Goh, Teck Joo Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Ganeshamoorthy, K. Jeevan teck.joo.goh@intel.com knseetharamu@hotmail.com gaquadir@unimap.edu.my Dissipation factor Finite element analysis Programming and algorithm theory Regression analysis Link to publisher's homepage at http://www.emeraldinsight.com/ This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources in silicon chip design layout that leads to the desired junction temperature, Tj. Key thermal parameters investigated are the heat source placement distance, level of heat dissipation, and magnitude of convection heat transfer coefficient. Finite element method (FEM) is used to investigate the effect of the key parameters. From the FEM results, a multiple linear regression model employing the least-square method is developed that relates all three parameters into a single correlation which would predict the maximum junction temperature, Tj,max. 2014-04-23T05:06:44Z 2014-04-23T05:06:44Z 2004 Article Microelectronics International, vol. 21(3), 2004, pages 29-43 1356-5362 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33947 http://dx.doi.org/10.1108/13565360410549701 http://www.emeraldinsight.com/journals.htm?articleid=1508847 en Emerald Group Publishing Limited |
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English |
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Dissipation factor Finite element analysis Programming and algorithm theory Regression analysis |
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Dissipation factor Finite element analysis Programming and algorithm theory Regression analysis Goh, Teck Joo Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Ganeshamoorthy, K. Jeevan Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization |
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Link to publisher's homepage at http://www.emeraldinsight.com/ |
| author2 |
teck.joo.goh@intel.com |
| author_facet |
teck.joo.goh@intel.com Goh, Teck Joo Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Ganeshamoorthy, K. Jeevan |
| format |
Article |
| author |
Goh, Teck Joo Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Ganeshamoorthy, K. Jeevan |
| author_sort |
Goh, Teck Joo |
| title |
Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization |
| title_short |
Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization |
| title_full |
Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization |
| title_fullStr |
Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization |
| title_full_unstemmed |
Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization |
| title_sort |
thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization |
| publisher |
Emerald Group Publishing Limited |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33947 |
| _version_ |
1643797355416256512 |