Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software
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Trans Tech Publications
2014
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my.unimap-343362014-05-06T04:33:53Z Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software Mazlan, Mohamed A. Rahim Iqbal, M. A. Mohd Mustafa Al Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Mohd Nor Hakim, Hassan mazlan547@ppinang.uitm.edu.my mustafa_albakri@unimap.edu.my Microprocessors Plastic Leaded Chip Carrier Thermal Management Link to publisher's homepage at http://www.ttp.net/ Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and mounted horizontally on a printed circuit board, is carried out using a commercial CFD code, FLUENT™. The simulation is performed for 12 PLCC under different inlet velocities and chip powers. The contours of average junction temperatures are obtained for each package under different conditions. It is observed that the junction temperature of the packages decreases with increase in inlet velocity and increases with chip power. Moreover, the increase in package density significantly contributed to rise in temperature of chips. Thus the present simulation demonstrates that the chip density (the number of packages mounted on a given area), chip power and the coolant inlet velocity are strongly interconnected; hence their appropriate choice would be crucial. 2014-05-06T04:33:53Z 2014-05-06T04:33:53Z 2013 Article Advanced Materials Research, vol. 795, 2013, pages 603-610 978-303785811-0 1022-6680 http://www.scientific.net/AMR.795.603 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34336 en Trans Tech Publications |
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Microprocessors Plastic Leaded Chip Carrier Thermal Management |
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Microprocessors Plastic Leaded Chip Carrier Thermal Management Mazlan, Mohamed A. Rahim Iqbal, M. A. Mohd Mustafa Al Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Mohd Nor Hakim, Hassan Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software |
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Link to publisher's homepage at http://www.ttp.net/ |
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mazlan547@ppinang.uitm.edu.my |
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mazlan547@ppinang.uitm.edu.my Mazlan, Mohamed A. Rahim Iqbal, M. A. Mohd Mustafa Al Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Mohd Nor Hakim, Hassan |
| format |
Article |
| author |
Mazlan, Mohamed A. Rahim Iqbal, M. A. Mohd Mustafa Al Bakri, Abdullah Wan Yusra Hannanah, Wan Abdul Razak Mohd Nor Hakim, Hassan |
| author_sort |
Mazlan, Mohamed |
| title |
Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software |
| title_short |
Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software |
| title_full |
Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software |
| title_fullStr |
Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software |
| title_full_unstemmed |
Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software |
| title_sort |
numerical investigation of heat transfer of twelve plastic leaded chip carrier (plcc) by using computational fluid dynamic, fluent™ software |
| publisher |
Trans Tech Publications |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/34336 |
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1643797450589208576 |