The outcome of sintering parameters study toward the thermal properties of CuSiC composite

The outcome of sintering parameters study toward the thermal properties of CuSiC composite

Link to publisher's homepage at http://www.ttp.net/

Saved in:

Bibliographic Details
Main Authors:	Mohabattul Zaman, S NS Bukhari, Prof. Madya Ir., M.S.J. Hashmi, Dermot, Brabazon
Other Authors:	mzaman@unimap.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Coefficient of thermal expansion Copper Copper silicon carbide Electronic chips Integrated circuit Metal Matrix Composite (MMC) Packaging materials Powder metallurgy Silicon carbide (SiC) Sintering Thermal conductivity (TC)
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34467
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Universiti Malaysia Perlis
Language:	English

Description
Summary:	Link to publisher's homepage at http://www.ttp.net/