LED heat dissipation analysis using composite based cylindrical slug
Link to publisher's homepage at http://www.ttp.net/
Saved in:
| Main Authors: | , , |
|---|---|
| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications Inc.
2015
|
| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39128 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Universiti Malaysia Perlis |
| Language: | English |
| id |
my.unimap-39128 |
|---|---|
| record_format |
dspace |
| spelling |
my.unimap-391282015-03-06T09:11:17Z LED heat dissipation analysis using composite based cylindrical slug Zaliman, Sauli, Dr. Vairavan, Rajendaran Retnasamy, Vithyacharan zaliman@unimap.edu.my ANSYS Cu/Dia cylindrical heat slug Junction temperature LED Von mises stress Link to publisher's homepage at http://www.ttp.net/ The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports a simulation analysis on the heat dissipation of single chip LED package with based material, copper diamond (Cu/Dia) cylindrical heat slug.Ansys version 11 was utilized as the simulation platform. The junction temperature and stress of the LED chip under natural convection condition were evaluated with varied input power of 0.1 W, 0.5 W and 1 W. Results indicated the maximum junction temperature of LED chip was attained at input power of 1 W. 2015-03-06T09:11:17Z 2015-03-06T09:11:17Z 2014-02 Article Advanced Materials Research, vol.893, 2014, pages 803-806 1662-8985 http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39128 http://www.scientific.net/AMR.893.803 en Trans Tech Publications Inc. |
| institution |
Universiti Malaysia Perlis |
| building |
UniMAP Library |
| collection |
Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Malaysia Perlis |
| content_source |
UniMAP Library Digital Repository |
| url_provider |
http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
ANSYS Cu/Dia cylindrical heat slug Junction temperature LED Von mises stress |
| spellingShingle |
ANSYS Cu/Dia cylindrical heat slug Junction temperature LED Von mises stress Zaliman, Sauli, Dr. Vairavan, Rajendaran Retnasamy, Vithyacharan LED heat dissipation analysis using composite based cylindrical slug |
| description |
Link to publisher's homepage at http://www.ttp.net/ |
| author2 |
zaliman@unimap.edu.my |
| author_facet |
zaliman@unimap.edu.my Zaliman, Sauli, Dr. Vairavan, Rajendaran Retnasamy, Vithyacharan |
| format |
Article |
| author |
Zaliman, Sauli, Dr. Vairavan, Rajendaran Retnasamy, Vithyacharan |
| author_sort |
Zaliman, Sauli, Dr. |
| title |
LED heat dissipation analysis using composite based cylindrical slug |
| title_short |
LED heat dissipation analysis using composite based cylindrical slug |
| title_full |
LED heat dissipation analysis using composite based cylindrical slug |
| title_fullStr |
LED heat dissipation analysis using composite based cylindrical slug |
| title_full_unstemmed |
LED heat dissipation analysis using composite based cylindrical slug |
| title_sort |
led heat dissipation analysis using composite based cylindrical slug |
| publisher |
Trans Tech Publications Inc. |
| publishDate |
2015 |
| url |
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39128 |
| _version_ |
1643798987700961280 |