Copper-filled electrically conductive adhesives with enhanced shear strength

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Bibliographic Details
Main Authors:	Ho, Li Ngee, Dr., Hiroshi, Nishikawa
Other Authors:	lnho@unimap.edu.my
Format:	Article
Language:	English
Published:	ASM International 2015
Subjects:	Conductive adhesive Copper Electrical resistivity Shear strength Viscosity
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39299
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Institution:	Universiti Malaysia Perlis
Language:	English

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