The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA)
Organized by Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM), 18th - 19th May 2005 at Putra Palace Hotel, Kangar.
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Kolej Universiti Kejuruteraan Utara Malaysia
2009
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my.unimap-71242009-09-03T02:30:03Z The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA) Noor Mariamadzliza, Mohd Nan Mohabattul Zaman, Bukhari, Ir. Assoc. Prof. Noor Azira, Mohd Noor Mohd Nazry, Salleh Printed circuit boards Printed circuits Solder pastes Solder and soldering Surface mounted device (SMD) Surface Mount Technology Organized by Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM), 18th - 19th May 2005 at Putra Palace Hotel, Kangar. Surface Mount Technology or SMT is a rapidly evolving field in the manufacture of electronic components, involving either active (transistors, integrated circuits, diodes, etc) or passive (capacitor, resistors, inductors, coils, etc) which do not have leaded connections. This technique which is SMT, replaces the old technique which the older package tended to use through-hole pins, which pass through holes in a printed circuit board and were soldered from below. The pins contributed inductance, and the size of the holes limits the density of the pins. SMT packages are soldered to the surface of a printed circuit board to alleviate this problem. These techniques are applied to the PCB, mounted components and solder paste. The comparison among the application of PCB, mounted components and solder paste in the SMTA will be shared and compared. 2009-09-03T02:30:03Z 2009-09-03T02:30:03Z 2005-05-18 Working Paper p.145-151 http://hdl.handle.net/123456789/7124 en Proceedings of the 1st National Conference on Electronic Design Kolej Universiti Kejuruteraan Utara Malaysia |
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Printed circuit boards Printed circuits Solder pastes Solder and soldering Surface mounted device (SMD) Surface Mount Technology |
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Printed circuit boards Printed circuits Solder pastes Solder and soldering Surface mounted device (SMD) Surface Mount Technology Noor Mariamadzliza, Mohd Nan Mohabattul Zaman, Bukhari, Ir. Assoc. Prof. Noor Azira, Mohd Noor Mohd Nazry, Salleh The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA) |
description |
Organized by Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM), 18th - 19th May 2005 at Putra Palace Hotel, Kangar. |
format |
Working Paper |
author |
Noor Mariamadzliza, Mohd Nan Mohabattul Zaman, Bukhari, Ir. Assoc. Prof. Noor Azira, Mohd Noor Mohd Nazry, Salleh |
author_facet |
Noor Mariamadzliza, Mohd Nan Mohabattul Zaman, Bukhari, Ir. Assoc. Prof. Noor Azira, Mohd Noor Mohd Nazry, Salleh |
author_sort |
Noor Mariamadzliza, Mohd Nan |
title |
The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA) |
title_short |
The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA) |
title_full |
The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA) |
title_fullStr |
The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA) |
title_full_unstemmed |
The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA) |
title_sort |
application of pcb, mountedccomponents and solder paste in surface mount technology assembly (smta) |
publisher |
Kolej Universiti Kejuruteraan Utara Malaysia |
publishDate |
2009 |
url |
http://dspace.unimap.edu.my/xmlui/handle/123456789/7124 |
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1643788697614680064 |