Optimization of Gating system in semiconductor packaging

Organized by School of Mechatronic Engineering (UniMAP) & co-organized by The Institution of Engineering Malaysia (IEM), 11th - 13th October 2009 at Batu Feringhi, Penang, Malaysia.

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Bibliographic Details
Main Authors:	F.Y. Lim, S. Abdullah, I. Ahmad
Format:
Language:	English
Published:	Universiti Malaysia Perlis 2009
Subjects:	Semiconductors Semiconductor technology Semiconductor packaging Electronic packaging Electronic packaging > Design and construction
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/7214
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Institution:	Universiti Malaysia Perlis
Language:	English

id	my.unimap-7214
record_format	dspace
spelling	my.unimap-72142009-11-17T06:19:45Z Optimization of Gating system in semiconductor packaging F.Y. Lim S. Abdullah I. Ahmad Semiconductors Semiconductor technology Semiconductor packaging Electronic packaging Electronic packaging -- Design and construction Organized by School of Mechatronic Engineering (UniMAP) & co-organized by The Institution of Engineering Malaysia (IEM), 11th - 13th October 2009 at Batu Feringhi, Penang, Malaysia. The development of three dimensional semiconductor packaging with embedded microchannel heat sinks were undertaken. Main purpose of the investigation was to gain more insights on the characteristics of the fluid flow motion and heat transfer in the semiconductor packaging. Several designs which consist of microchannel and manifold channel were simulated. The system was modelled using the Navier-Stokes equations and general heat transfer quations via declaring the stacked microchannel as a porous media. Location of the peak temperature was identified which occurred around sharp corners. Further investigations were carried out specifically on the region around the peak temperature and a new design was proposed to reduce the peak temperature and improve the temperature uniformity along the semiconductor packaging. It was found usage of a fillet design eliminates the swirling pattern in the microchannel bends which is the main cause of the relatively high peak temperature and non-uniform temperature distribution. 2009-11-08T08:48:53Z 2009-11-08T08:48:53Z 2009-10-11 p.7C 1 - 7C 4 978-967-5415-07-4 http://hdl.handle.net/123456789/7214 en Proceedings of International Conference on Applications and Design in Mechanical Engineering 2009 (iCADME 2009) Universiti Malaysia Perlis
institution	Universiti Malaysia Perlis
building	UniMAP Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaysia Perlis
content_source	UniMAP Library Digital Repository
url_provider	http://dspace.unimap.edu.my/
language	English
topic	Semiconductors Semiconductor technology Semiconductor packaging Electronic packaging Electronic packaging -- Design and construction
spellingShingle	Semiconductors Semiconductor technology Semiconductor packaging Electronic packaging Electronic packaging -- Design and construction F.Y. Lim S. Abdullah I. Ahmad Optimization of Gating system in semiconductor packaging
description	Organized by School of Mechatronic Engineering (UniMAP) & co-organized by The Institution of Engineering Malaysia (IEM), 11th - 13th October 2009 at Batu Feringhi, Penang, Malaysia.
format
author	F.Y. Lim S. Abdullah I. Ahmad
author_facet	F.Y. Lim S. Abdullah I. Ahmad
author_sort	F.Y. Lim
title	Optimization of Gating system in semiconductor packaging
title_short	Optimization of Gating system in semiconductor packaging
title_full	Optimization of Gating system in semiconductor packaging
title_fullStr	Optimization of Gating system in semiconductor packaging
title_full_unstemmed	Optimization of Gating system in semiconductor packaging
title_sort	optimization of gating system in semiconductor packaging
publisher	Universiti Malaysia Perlis
publishDate	2009
url	http://dspace.unimap.edu.my/xmlui/handle/123456789/7214
_version_	1643788760151752704

Optimization of Gating system in semiconductor packaging

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