Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging
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Universiti Malaysia Perlis (UniMAP)
2022
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my.unimap-762862022-10-06T02:32:48Z Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging A., Suhaimi G., Omar M T Asmah uhaimi.azizan83@gmail.com Asmaja Ventures, Kajang Fakulti Kejuruteraan Mekanikal, Universiti Teknikal Malaysia Melaka (UTeM) Automotive packaging Delamination Pre-plated leadframe Reliability Surface texturing Link to publisher's homepage at http://ijneam.unimap.edu.my Poor adhesion between mold compound and leadframe in integrated circuit packaging for automotive devices can cause serious reliability issue and degrade the package quality. This study aims to evaluate and understand the correlation between surface texturing procedure (roughening) on pre-plated leadframe (PPF) and delamination phenomenon in integrated circuit packaging. The pre-plated leadframe with textured surface was prepared by the leadframe supplier. Four major evaluations were conducted which based on morphology analysis, contact angle measurement, mold shear strength test and reliability test. For morphology analysis, textured PPF possessed higher surface roughness (284nm) compared with standard leadframe (174nm). The highest contact angle value was observed for textured PPF at room temperature (71°). Conversely, the lowest contact angle value was observed for textured PPF at 175°C (55°) which was simulated according to inline manufacturing condition. High shear strength test was obtained for textured PPF compared with standard leadframe. Furthermore, reliability test proved that no delamination was detected for PPF sample. However, this phenomenon was observed for standard leadframe. All the observations agreed that the interfacial adhesion between mold compound and leadframe was significantly improved by surface texturing procedure on the leadframe. The improvement of adhesion helps to eliminate delamination and improve package reliability. 2022-10-06T02:32:48Z 2022-10-06T02:32:48Z 2022-07 Article International Journal of Nanoelectronics and Materials, vol.15(3), 2022, pages 197-206 1985-5761 (Printed) 1985-5761 (Printed) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76286 http://ijneam.unimap.edu.my en Universiti Malaysia Perlis (UniMAP) |
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Malaysia |
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Universiti Malaysia Perlis |
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| language |
English |
| topic |
Automotive packaging Delamination Pre-plated leadframe Reliability Surface texturing |
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Automotive packaging Delamination Pre-plated leadframe Reliability Surface texturing A., Suhaimi G., Omar M T Asmah Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging |
| description |
Link to publisher's homepage at http://ijneam.unimap.edu.my |
| author2 |
uhaimi.azizan83@gmail.com |
| author_facet |
uhaimi.azizan83@gmail.com A., Suhaimi G., Omar M T Asmah |
| format |
Article |
| author |
A., Suhaimi G., Omar M T Asmah |
| author_sort |
A., Suhaimi |
| title |
Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging |
| title_short |
Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging |
| title_full |
Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging |
| title_fullStr |
Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging |
| title_full_unstemmed |
Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging |
| title_sort |
correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging |
| publisher |
Universiti Malaysia Perlis (UniMAP) |
| publishDate |
2022 |
| url |
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76286 |
| _version_ |
1751537911929503744 |