Thermal-mechanical analysis of bonding pad in insulated gate bipolar transistor

Thermal-mechanical analysis of bonding pad in insulated gate bipolar transistor

Master of Science Microelectronic System Design Engineering

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Bibliographic Details
Main Author: Ong, Chiew Yeong
Other Authors: Vithyacharan, Retnasamy, Dr.
Format: Thesis
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2018
Subjects:
Insulated gate bipolar transistors
Bipolar transistors
Wire bonding (Electronic packaging)
Planar transistors
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77429
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Institution: Universiti Malaysia Perlis
Language: English

Internet

http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77429

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