Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)

Thermal cycling test is one of the reliability test that has been used to evaluate the reliability of the solder joint interconnect in ball grid array (BGA) package. The purpose of thermal cycling test is to characterize thermomechanical failure mechanism on microelectronics package. This research...

Full description

Saved in:
Bibliographic Details
Main Author: Muhammad Nubli, Zulkifli
Format: Thesis
Language:English
Published: Universiti Malaysia Perlis 2010
Subjects:
Microelectronic package
Temperature cycling
Solder joint fatigue life
Thermal cycling test
Ball grid array (BGA)
Finite elements analysis (FEA)
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/9878
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Universiti Malaysia Perlis
Language: English

Internet

http://dspace.unimap.edu.my/xmlui/handle/123456789/9878

Similar Items