Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application
THS TK7870.T36 2012
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| Language: | English |
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2023
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| Institution: | Universiti Tenaga Nasional |
| Language: | English |
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my.uniten.dspace-195332023-05-04T17:31:03Z Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application Tan Cai Hui THS TK7870.T36 2012 2023-05-03T13:36:40Z 2023-05-03T13:36:40Z 2012-06 Resource Types::text::Thesis https://irepository.uniten.edu.my/handle/123456789/19533 en application/pdf |
| institution |
Universiti Tenaga Nasional |
| building |
UNITEN Library |
| collection |
Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Tenaga Nasional |
| content_source |
UNITEN Institutional Repository |
| url_provider |
http://dspace.uniten.edu.my/ |
| language |
English |
| description |
THS TK7870.T36 2012 |
| format |
Resource Types::text::Thesis |
| author |
Tan Cai Hui |
| spellingShingle |
Tan Cai Hui Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application |
| author_facet |
Tan Cai Hui |
| author_sort |
Tan Cai Hui |
| title |
Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application |
| title_short |
Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application |
| title_full |
Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application |
| title_fullStr |
Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application |
| title_full_unstemmed |
Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application |
| title_sort |
characterization of micropearl polymer core solder ball for bga semiconductor packaging application |
| publishDate |
2023 |
| _version_ |
1806425747422707712 |