Manufacturability readiness of insulated Cu wire bonding process in PBGA package

• Main Authors: Hungyang L., Boonkar Y., Yong T.C., Khan N., Ibrahim M.R., Tan L.C.
• Other Authors: 56535329100
• Format: Conference Paper
• Published: Institute of Electrical and Electronics Engineers Inc. 2023
• Institution: Universiti Tenaga Nasional

Today, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is...