Spatial analysis of underfill flow in flip-chip encapsulation
Air; Filling; Flip chip devices; Flow patterns; Soldering; Design/methodology/approach; Flip-chip encapsulation; Package designers; Process enhancements; Research studies; Spatial analysis; Unit cell approach; Visualization tools; Spatial variables measurement
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| Main Authors: | , , |
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| Other Authors: | |
| Format: | Article |
| Published: |
Emerald Group Holdings Ltd.
2023
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| Institution: | Universiti Tenaga Nasional |