A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages

This study investigates the effects of two different catalytic activation techniques on the thermal performance of the flip-chip heat spreaders. The two activation techniques studied are thin nickel-copper strike and galvanic initiation. Thermal diffusivity and surface roughness of these heat spread...

Full description

Saved in:

Bibliographic Details
Main Authors:	Amin N., Lim V., Seng F.C., Razid R., Ahmad I.
Other Authors:	7102424614
Format:	Article
Published:	2023
Subjects:	Copper Electric batteries Electronics packaging Flip chip devices Heating equipment Mixed convection Nickel Nickel alloys Surface roughness Thermal conductivity Thermal diffusion Activation techniques After high temperatures Catalytic activations Copper heat spreaders Copper layers Copper strikes Flip chips Flip-chip ball grid arrays Heat spreaders High temperature storage tests Initial time Intermetallic diffusions Low thermal conductivities Practical investigations Semiconductor packages Thermal performance Spreaders
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Universiti Tenaga Nasional

id	my.uniten.dspace-30930
record_format	dspace
spelling	my.uniten.dspace-309302023-12-29T15:56:04Z A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages Amin N. Lim V. Seng F.C. Razid R. Ahmad I. 7102424614 26432767800 26432892000 26432743300 12792216600 Copper Electric batteries Electronics packaging Flip chip devices Heating equipment Mixed convection Nickel Nickel alloys Surface roughness Thermal conductivity Thermal diffusion Activation techniques After high temperatures Catalytic activations Copper heat spreaders Copper layers Copper strikes Flip chips Flip-chip ball grid arrays Heat spreaders High temperature storage tests Initial time Intermetallic diffusions Low thermal conductivities Practical investigations Semiconductor packages Thermal performance Spreaders This study investigates the effects of two different catalytic activation techniques on the thermal performance of the flip-chip heat spreaders. The two activation techniques studied are thin nickel-copper strike and galvanic initiation. Thermal diffusivity and surface roughness of these heat spreaders were studied using the Nano-flash Apparatus and Infinite Focus Microscopy. High temperature storage tests were carried out to investigate the extent of intermetallic diffusion between the nickel and copper layers. The results show that heat spreaders with thin nickel-copper strike catalytic activation technique have a lower thermal diffusivity due to the low thermal conductivity of nickel-copper layer. Moreover, the nickel-copper layers grew thicker from around 0.2 ?m at initial time to around 0.55 ?m after high temperature storage duration of 168 h. On the other hand, heat spreaders processed using the galvanic initiation technique did not form any nickel-copper intermetallic diffusion layer. As a conclusion, the galvanic initiation technique can potentially provide better thermal performance for heat spreaders used in semiconductor packages. � 2009 Elsevier Ltd. All rights reserved. Final 2023-12-29T07:56:04Z 2023-12-29T07:56:04Z 2009 Article 10.1016/j.microrel.2009.02.013 2-s2.0-67349100528 https://www.scopus.com/inward/record.uri?eid=2-s2.0-67349100528&doi=10.1016%2fj.microrel.2009.02.013&partnerID=40&md5=f5c9ba763599df05424c2252ba3aeef4 https://irepository.uniten.edu.my/handle/123456789/30930 49 5 537 543 Scopus
institution	Universiti Tenaga Nasional
building	UNITEN Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Tenaga Nasional
content_source	UNITEN Institutional Repository
url_provider	http://dspace.uniten.edu.my/
topic	Copper Electric batteries Electronics packaging Flip chip devices Heating equipment Mixed convection Nickel Nickel alloys Surface roughness Thermal conductivity Thermal diffusion Activation techniques After high temperatures Catalytic activations Copper heat spreaders Copper layers Copper strikes Flip chips Flip-chip ball grid arrays Heat spreaders High temperature storage tests Initial time Intermetallic diffusions Low thermal conductivities Practical investigations Semiconductor packages Thermal performance Spreaders
spellingShingle	Copper Electric batteries Electronics packaging Flip chip devices Heating equipment Mixed convection Nickel Nickel alloys Surface roughness Thermal conductivity Thermal diffusion Activation techniques After high temperatures Catalytic activations Copper heat spreaders Copper layers Copper strikes Flip chips Flip-chip ball grid arrays Heat spreaders High temperature storage tests Initial time Intermetallic diffusions Low thermal conductivities Practical investigations Semiconductor packages Thermal performance Spreaders Amin N. Lim V. Seng F.C. Razid R. Ahmad I. A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages
description	This study investigates the effects of two different catalytic activation techniques on the thermal performance of the flip-chip heat spreaders. The two activation techniques studied are thin nickel-copper strike and galvanic initiation. Thermal diffusivity and surface roughness of these heat spreaders were studied using the Nano-flash Apparatus and Infinite Focus Microscopy. High temperature storage tests were carried out to investigate the extent of intermetallic diffusion between the nickel and copper layers. The results show that heat spreaders with thin nickel-copper strike catalytic activation technique have a lower thermal diffusivity due to the low thermal conductivity of nickel-copper layer. Moreover, the nickel-copper layers grew thicker from around 0.2 ?m at initial time to around 0.55 ?m after high temperature storage duration of 168 h. On the other hand, heat spreaders processed using the galvanic initiation technique did not form any nickel-copper intermetallic diffusion layer. As a conclusion, the galvanic initiation technique can potentially provide better thermal performance for heat spreaders used in semiconductor packages. � 2009 Elsevier Ltd. All rights reserved.
author2	7102424614
author_facet	7102424614 Amin N. Lim V. Seng F.C. Razid R. Ahmad I.
format	Article
author	Amin N. Lim V. Seng F.C. Razid R. Ahmad I.
author_sort	Amin N.
title	A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages
title_short	A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages
title_full	A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages
title_fullStr	A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages
title_full_unstemmed	A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages
title_sort	practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages
publishDate	2023
_version_	1806428012917293056

A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages

Similar Items