Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology

Wire bonding of 20micron 2N wire using conventional pink capillary for ultra Fine Pitch package results in high stoppages of short tail which causes machine to stop, higher yield loss and reduced equipment efficiency and stability. The objective of present study is to improve the 2nd bond quality an...

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Main Authors: Nor N.H.M., Taib S., Ahmad I., Abdullah H.
Other Authors: 57219925855
Format: Conference paper
Published: 2023
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Institution: Universiti Tenaga Nasional
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spelling my.uniten.dspace-310002023-12-29T15:57:39Z Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology Nor N.H.M. Taib S. Ahmad I. Abdullah H. 57219925855 26633364600 12792216600 26025061200 Capillarity Electric batteries Electronics packaging Electroplating Energy transfer High temperature superconductors Lead compounds Lead plating Metallic compounds Morphology Surface analysis Wire After high temperature Bond quality Cross-section analysis Energy transfer efficiency Equipment efficiency Higher yield Inter-layers Mechanical interlocking New design Physical inspection Production yield Relative displacement SEM image Statistical analysis Thermal cycle Ultra fine pitch Wire bonding Wire bonds Surface morphology Wire bonding of 20micron 2N wire using conventional pink capillary for ultra Fine Pitch package results in high stoppages of short tail which causes machine to stop, higher yield loss and reduced equipment efficiency and stability. The objective of present study is to improve the 2nd bond quality and stability for reducing the stoppages caused by the short tail. The new design, called as Fortus capillaries have granular tip surface morphology that improves mechanical interlocking, relative displacement between capillary's tip and wire, and also improve the energy transfer efficiency at wire-lead inter layer surface. Statistical analysis comparisons and internal physical inspection were done through SEM image at 0 hour, 96 hours and 192 hours after High Temperature Storage (HTS) and 500 and 1000x Thermal cycle. Cross section analysis was also done to study the Inter Metallic Compound (IMC) formation between wire and lead plating. The Fortus pink capillary effectiveness in reducing short tail was proven in actual production during 5000 unit wire bond process operation with 75% improvement of machine stoppages and resulting in significant improvement of production yield up to 99.5%. This new granular tip capillary also gave about 100% improvement compared to the conventional capillaries life �2008 IEEE. Final 2023-12-29T07:57:39Z 2023-12-29T07:57:39Z 2008 Conference paper 10.1109/SMELEC.2008.4770351 2-s2.0-65949083325 https://www.scopus.com/inward/record.uri?eid=2-s2.0-65949083325&doi=10.1109%2fSMELEC.2008.4770351&partnerID=40&md5=7e7485bb677e54f6f5bbe4280c90b489 https://irepository.uniten.edu.my/handle/123456789/31000 4770351 406 409 Scopus
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
topic Capillarity
Electric batteries
Electronics packaging
Electroplating
Energy transfer
High temperature superconductors
Lead compounds
Lead plating
Metallic compounds
Morphology
Surface analysis
Wire
After high temperature
Bond quality
Cross-section analysis
Energy transfer efficiency
Equipment efficiency
Higher yield
Inter-layers
Mechanical interlocking
New design
Physical inspection
Production yield
Relative displacement
SEM image
Statistical analysis
Thermal cycle
Ultra fine pitch
Wire bonding
Wire bonds
Surface morphology
spellingShingle Capillarity
Electric batteries
Electronics packaging
Electroplating
Energy transfer
High temperature superconductors
Lead compounds
Lead plating
Metallic compounds
Morphology
Surface analysis
Wire
After high temperature
Bond quality
Cross-section analysis
Energy transfer efficiency
Equipment efficiency
Higher yield
Inter-layers
Mechanical interlocking
New design
Physical inspection
Production yield
Relative displacement
SEM image
Statistical analysis
Thermal cycle
Ultra fine pitch
Wire bonding
Wire bonds
Surface morphology
Nor N.H.M.
Taib S.
Ahmad I.
Abdullah H.
Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology
description Wire bonding of 20micron 2N wire using conventional pink capillary for ultra Fine Pitch package results in high stoppages of short tail which causes machine to stop, higher yield loss and reduced equipment efficiency and stability. The objective of present study is to improve the 2nd bond quality and stability for reducing the stoppages caused by the short tail. The new design, called as Fortus capillaries have granular tip surface morphology that improves mechanical interlocking, relative displacement between capillary's tip and wire, and also improve the energy transfer efficiency at wire-lead inter layer surface. Statistical analysis comparisons and internal physical inspection were done through SEM image at 0 hour, 96 hours and 192 hours after High Temperature Storage (HTS) and 500 and 1000x Thermal cycle. Cross section analysis was also done to study the Inter Metallic Compound (IMC) formation between wire and lead plating. The Fortus pink capillary effectiveness in reducing short tail was proven in actual production during 5000 unit wire bond process operation with 75% improvement of machine stoppages and resulting in significant improvement of production yield up to 99.5%. This new granular tip capillary also gave about 100% improvement compared to the conventional capillaries life �2008 IEEE.
author2 57219925855
author_facet 57219925855
Nor N.H.M.
Taib S.
Ahmad I.
Abdullah H.
format Conference paper
author Nor N.H.M.
Taib S.
Ahmad I.
Abdullah H.
author_sort Nor N.H.M.
title Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology
title_short Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology
title_full Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology
title_fullStr Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology
title_full_unstemmed Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology
title_sort ultra fine pitch 20 micron 2n second bond improvement with new capillary surface morphology
publishDate 2023
_version_ 1806423507126452224