Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates
Reflow soldering process is one of the important steps in the manufacturing process for ball grid arrays. The purpose of this study is to observe the metallurgical bonding between Sn3.5Ag solder ball and electroless nickel immersion gold (ENIG) substrates after reflow soldering process. The reflow s...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | |
| Published: |
2017
|
| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5231 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Universiti Tenaga Nasional |
Be the first to leave a comment!